CMOS chip and cover glass height measurement
TS-P series Laser Triangulation Displacement Sensor
In the semiconductor industry, the TS-P series laser triangulation displacement sensor is widely used for height measurement of CMOS chips and cover glass. For instance, in the packaging testing process, precise measurement of the distance between the chip and the cover glass enables effective assessment of packaging quality and timely identification of potential issues, thereby enhancing product quality and reliability.
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