TS-P series Laser Triangulation Displacement Sensor

In order to cope with the rising price of polycrystalline silicon, silicon wafer manufacturers will alleviate cost pressures on downstream battery and module customers by thinning the silicon wafer thickness. Thinning (reducing silicon wafer thickness from 180μm to 130μm or even lower) can reduce silicon material usage, increasing the output yield per unit of silicon material, and enabling battery manufacturers to obtain cheaper photovoltaic silicon wafers. Although thinning has little impact on battery performance, it tests the stability, yield, and breakage rate of silicon wafer and battery manufacturers in production. Due to the increased fluctuation in original silicon wafer thickness during the thinning process compared to 180μm wafers, it directly causes significant dispersion in efficiency distribution at the battery end, reducing the overall comprehensive profit of battery manufacturers. The quality of silicon wafers directly affects subsequent manufacturing and processing processes, where the thickness of wafers and defects in cutting lines can impact the fragments and electrical performance of subsequent battery cells, requiring defective wafers to be detected and selected before further processing steps. Chinsight’s TS-P Series Laser Triangulation Displacement Sensor, with multiple sets of opposing measurement fixtures, can achieve thickness and line defect measurements at different positions of different silicon wafers.