Precise Chip Mounting Height Measurement with TronSight TS-C Sensor

3C02.Chip Mounting Height Measurement Solutions for High-Quality PCB Assembly

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3C02.Chip Mounting Height Measurement Solutions for High-Quality PCB Assembly

Aug 15, 2025

1. Why Chip Mounting Height Measurement Matters

In modern electronics manufacturing, the mounting height of chips directly affects the performance, reliability, and appearance of the final product.

Performance stability: Incorrect height can lead to poor solder joint connections, increasing the risk of electrical failure.
Production efficiency: Accurate height control reduces rework, improving throughput.
Quality assurance: Meeting strict IPC standards ensures product competitiveness in high-end markets such as automotive, aerospace, and medical devices.

2. Common Measurement Methods: Pros and Cons

Measurement Method	Principle	Advantages	Limitations
Contact-type probe measurement	Physical probe touches the surface	Simple structure, low cost	Risk of damaging chips; slow speed; not suitable for soft/fragile surfaces
Laser triangulation	Measures displacement via light angle	Non-contact, relatively fast	Limited accuracy on reflective or transparent surfaces
Vision measurement	Uses camera image analysis	Easy integration; can inspect multiple points at once	Accuracy affected by lighting; difficulty with transparent layers
Chromatic confocal measurement	Analyzes wavelength shift from multi-spectrum light	High precision; works on transparent, reflective, and curved surfaces; no damage to target	Higher cost; requires proper alignment

3. Principle and Process of Chromatic Confocal Measurement

Chromatic confocal displacement sensors use broad-spectrum light and a wavelength analysis principle:

Step 1: White light passes through a chromatic lens, splitting into different wavelengths along the optical axis.
Step 2: Only the wavelength in focus on the target surface is reflected back into the sensor.
Step 3: The spectrometer detects the peak wavelength, which is then converted into a precise height value.

Advantages in chip mounting height measurement:

Non-contact measurement avoids physical damage.
Compatible with transparent chip surfaces, solder pads, and even multi-layer structures.
High-speed sampling up to 32kHz enables inline inspection in SMT production lines.

4. TronSight’s Solution

The TronSight TS-C Series Chromatic Confocal Displacement Sensor offers:

Up to 32kHz sampling rate with 16-channel fully synchronous acquisition（some modles）.
EtherCAT compatibility for seamless integration into automated production lines.
Wide probe variety — maximum measuring angle ±60°, minimum probe diameter 3.8mm, adaptable to high-temperature and vacuum environments.
Multi-layer measurement capability for chips with transparent encapsulation or coatings.

Application example:
In an SMT line, the TS-C sensor is mounted on a precision stage above the PCB. As the PCB moves into position, the sensor measures each chip’s mounting height in real time, automatically flagging deviations from the tolerance range. This ensures consistent assembly quality without slowing down production.